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VLSI Physical Design  ›  Ch 3. Placement & Congestion

if all those paths are violating and the change improves slack.

KEY Insert the buffer near the capture flop to avoid disturbing other paths that share the launch flop.

Power-Aware Placement

Low-power (power-aware) placement uses the available switching-activity data to shorten the wires of high-activity nets. It does not perform optimization itself - for example it does not resize drivers - but it runs alongside timing, power, DRC and congestion optimization, which does resize cells.

KEY Power-aware placement shortens high-activity nets using switching data, running alongside other optimization.

Isolation Cell Placement

The isolation cell should be located in the always-on (AON) domain.

KEY Isolation cells belong in the always-on domain.

Targets at the Placement Stage

  • Meeting timing - WNS (worst negative slack), TNS (total negative slack) and FEP (failing endpoints), mainly for register-to-register paths.
  • Keeping congestion within limits (around 0.5% horizontal and vertical overflow; for lower-tech hotspots, total overflow under 10000 and the maximum under 200).
  • Controlling cell density.
  • Controlling pin density.

KEY Placement targets: meet timing (WNS/TNS/FEP), keep congestion in limit, and control cell and pin density.

Inputs Needed for Placement

  • A design with floorplanning fully completed.
  • The SDC and MMMC setup.
  • Design targets such as max_trans and max_area.